But we’re not stopping here..
The data centre industry is changing rapidly due to the progress of AI. The amount of heat generated has exceeded the limits of traditional cooling solutions.
The progress of computing power following Moore’s Law is slowing down. Therefore, the industry has to find new ways to keep increasing processing power whilst dealing with the excess heat produced.
End of Moore’s Law is keeping the integrated circuits industry actively looking for alternatives meet the growing demand and 3D integrated chip is the next step. In computer processors, thermal management is crucial, since excessive heat reduces the performance benefits gained by traditional chip scaling. Consequently, cooling systems are essential for 3D integrated chips and current heat removal solutions are not sufficient.
What do we have in mind?
Incooling has designed high pressure 2-phase cooling system which is integrated inside the chip packaging. By utilizing the unique properties of the system we can dissipate the excess heat of the computing units in a more direct, efficient way whilst creating an optimal thermal environment, ideal for processors with a high heat density. Our solution will help server manufacturers to manage heat loads, since it creates an extremely fast, stable and energy efficient system. With our solution, the semiconductor industry can foresee a future where Moore’s law will always be alive.